Taipei, May 15, 2008 (CENS)--Advanced Semiconductor Engineering (ASE) Inc. and subsidiary Universal Scientific Industrial Co., (USIC) Ltd. recently won contracts to make wireless modules using system-in-package (SiP) technology for Intel.

ASE is one of a few test and assembly houses worldwide to begin using SiP technology to make chips for customers. The technology is more suitable for system-on-chips (SOCs) installed with smaller circuits on them than chip-on-board (COB) packaging technology.

The module is equipped with wireless chips whose circuit geometry is shrunk to 65 nanometers, rendering COB unsuitable in this production. The module, codenamed Echo Peak, support 802.11n and WiMAX wireless specifications.

Sub-system maker USIC will make the modules under ASE`s technological assistance. USIC began introducing mini wireless modules last year using ASE`s 3D SiP technology.

The wireless module will go into the Intel Montevina platform for notebook computers. The world`s No.1 chipmaker will introduce the platform, the update version of Centrno platform, at the Computex computer trade show in June in Taipei.

Industry watchers estimated the trend of 802.11n specification moving toward replacing 802.11g to become a boost to USIC`s shipments of 802.11n products in the third quarter.

SiP is rising as mainstream packaging technology along with circuit geometry becoming smaller. Even silicon-foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) has put over NT$100 million (US$3.3 million) into research and development of the advanced packaging technology. Contract chip designers Global Unichip Corp. and Faraday Technology Corp. have recently introduced SiP design process.

Industry insiders pointed out that impressed by the promising market for SiP technology more and more test and assembly houses were gearing up to acquire sub-system makers.
(by Ken Liu)